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Tombstoning and off-set are typical defects which occur during the assembly of electronic devices. These are capable of defects in the final product, malfunction and other low-quality in the electronic devices. But fortunately, with the evolution of the technology, it does which is with the help of the advanced technology and or process like automated optical inspection and preventing theft and or tombstoning by PCB assembly.
What tombstoning and toeing in electronic components are all about
Tombstoning (ferrous tombstoning, eddy current effect) Rare form of a component (resistor or capacitor) standing up on end, one end of component is attached, other is raised up, behaves like a tombstone. This occurs when the two solder pads on each side of the component are heated non uniformly, and it makes the component tilt which result with it being out of place. Misalignment is when a part is not located perfectly on the PCB during the board assembly. Tombstoning and misalignment may both cause electrical and mechanical problems in the electronic device.
Contribution of AOI for tombstoning and misalignment detection
Automated optical inspection (AOI) is a technology used to provide a full range of inspection and testing services for electronics manufacturers and suppliers. Tombstoning and misalignment are easily recognizable by AOI systems as we use their images of the components on the PCB. AOI system cameras record high-resolution images of the components which are then used by the algorithms to match the intended position of the components with their real position. If any tombstoning or misregistration is found, the aoi machine will identify the defect for verification and possible correction.
Utilizing AI to Detect and Eliminate Tombstoning in PCB Assembly
The detection of tombstoning and misalignment on PCB assembly has been enhanced through the implementation of artificial intelligence (AI) technology in AOI systems. Through this, the AI algorithm can be trained from previous inspections and improve determination of the defect with increasing accuracy. AI can use vast amounts of data to detect patterns and anomalies that could suggest tombstoning or misalignment. As a result, the aoi inspection machine system can rapidly and precisely identify defective parts and prevent attempts to ship them to finished good processing.
More reasons for misalignment and how AOI helps avoid defects
There can be a number of different reasons why electronic components may be misaligned, including poor placement by a pick-and-place machine, uneven temperature during soldering, and variations in the size or shape of the components. Misalignment can be avoided by the use of AOI system to look over each element on the PCB and inspect its position and direction. If any mistakes are found, the 2D AOI Inspection Equipment system signals the operator to rework the part before it creates bigger problems later on in the production chain. It detects misalignments on a part before it’s too late in the assembly process – pre- to minimize that defect from reaching your customer.